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SERIS researchers develop new polysilicon texture technology

2018/04/16

 

 

 

      _cc781905-5cde-3194-bb3b-136bad Novel wet chemical method that utilizes diamond wire saw technology to cut polysilicon wafers and subsequently texture to reduce reflectivity.

        Wet etch wafers with nanometer scale features , thereby increasing the number of times the light reflects off the surface and the chance of being absorbed by the wafer material. The process uses proprietary chemistries, is low-cost, scalable, and can be easily integrated into battery production lines.

      _cc781905-5cde-3194-bb3b-136bad It can provide more benefits to manufacturers. Said that their technology is "simpler, cheaper, and metal-free, and can achieve cell efficiencies of more than 20%" and has the potential to become a mainstream texturing technology widely used by polycrystalline silicon solar cell manufacturers.

      _cc781905-5cde-3194-bb3d_cf58d_ _cc781905-5cde-3194-bb3b-136bad 's approval. The agency is ready to work closely with these manufacturers to expand to large production lines.

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